Xiaomi Xring O1 has now shipped more than 1 million units, according to figures shared by Xiaomi founder, chairman, and CEO Lei Jun during the company’s investor day event.
That number gives a clearer sense of how far Xiaomi’s in-house silicon effort has already moved beyond the concept stage. As earlier reporting noted, the Xiaomi chip uses an advanced 3nm manufacturing process, putting it in a category that only a small number of smartphone brands can realistically pursue on their own.
Apple has long relied on its A-series chips, Samsung continues to develop Exynos, and most other handset makers still depend heavily on Qualcomm and MediaTek. Against that backdrop, Xiaomi’s progress with the Xiaomi Xring O1 stands out as a significant strategic step rather than a one-off experiment.
Xiaomi Group partner and president Lu Weibing previously said this is the company’s first chip product and suggested future upgrades could arrive on a yearly basis. Lei Jun also said at Xiaomi’s 15th anniversary strategy launch last year that the company restarted its large-chip development program in 2021 with a plan to invest for at least 10 years and commit at least 50 billion yuan.
By the end of April 2025, Xiaomi’s disclosed R&D spending on the Xring program had already exceeded 13.5 billion yuan. That helps explain why the company keeps framing its in-house mobile SoC roadmap as a long-term platform move rather than a short marketing cycle.
The report also points to what may come next. A mysterious Xiaomi foldable carrying model number 2608BPX34C has reportedly appeared in code repositories. It could end up launching as the MIX Fold 5, or possibly under the Xiaomi 17 Fold name, and the code is said to reference an Xring O3 chip. If that detail holds up, Xiaomi may skip the Xring O2 branding altogether.
