A new report suggests Samsung’s upcoming Samsung Exynos 2700 may adopt a side-by-side packaging layout that places RAM next to the SoC rather than stacking it in a more traditional arrangement.
According to the source report, the goal is to improve thermals and data transfer efficiency at the same time. Samsung is said to be moving toward an SBS, or side-by-side, structure so the cooling layer can cover both the memory and the processor more directly, instead of trapping as much heat between stacked internal layers.
That matters because the earlier Exynos 2700 generation path reportedly built on techniques like HPB, or Heat Path Block, to improve heat dissipation above the memory layer. Even with that approach, stacked layouts can still make heat management more difficult when components are packed tightly together.
The leak also claims the new design could improve memory bandwidth by around 30% to 40%. If that estimate holds up, the gains wouldn’t just stay on a spec sheet. Shorter physical distance between RAM and the chip could help with faster app launches, smoother multitasking, and better gaming responsiveness in real-world use.
Nothing here is official yet, so the report should still be treated as an early look rather than a confirmed hardware announcement. Still, if Samsung really moves ahead with this side-by-side layout, the mobile processor could stand out for tackling heat and bandwidth together instead of treating them as separate problems.
