RedMagic has released a new hands-on preview for the RedMagic 11S Pro Plus, putting the spotlight on what it calls a pulsed liquid cooling engine ahead of the phone’s scheduled May 18 debut. The teaser comes from RedMagic gaming phone product general manager Jiang Chao, who showed the cooling effect in action on the device itself.
According to the company, the new pulsed liquid cooling engine uses a piezoelectric ceramic micro-pump to drive liquid circulation, and users will be able to adjust the flow speed. RedMagic also says it redesigned the liquid channel structure to improve circulation efficiency and speed up the pulse cycle.
RedMagic is positioning this as part of a much broader thermal package. The brand says the 11S Pro series is the only phone line in the industry to combine both fan cooling and liquid cooling in the same gaming-focused device. Its official spec highlights mention fluorinated liquid similar to what is used in AI servers, a new curved-flow channel design, an exclusive ceramic micro-pump, and protection against leaks and drops.
That cooling setup is paired with active air cooling hardware as well. RedMagic says the phone uses a 24,000 rpm fan, 0.1mm ultra-thin blades, a through-channel airflow design, and even an IPX8-rated waterproof fan. On top of that, the internal structure includes a 4D stepped VC system and a liquid metal 3.0 solution that the company says is safer because it doesn’t flow around freely.
Design-wise, the RedMagic 11S Pro Plus continues the brand’s signature transparent gamer aesthetic with visible liquid cooling elements. It will be offered in Silver Wing and Dark Night colorways and will use Qualcomm’s fifth-generation Snapdragon 8 Elite leading edition mobile platform.
For now, RedMagic is still holding back some of the full upgrade list for the launch event. Even so, this latest preview makes the brand’s priorities obvious: the next gaming phone is being sold on aggressive thermal engineering just as much as raw chipset power.
