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Dimensity PM Engineering Device Spotted with Sony LOFIC Sensor, Rumored as vivo X500 Pro Max

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Dimensity PM Engineering Device Spotted with Sony LOFIC Sensor, Rumored as vivo X500 Pro Max

A new engineering prototype featuring the 2nm Dimensity PM mobile platform and a high-end imaging setup has surfaced online. According to prominent leaker @DigitalChatStation, the test device’s main camera is equipped with a large Sony LOFIC sensor (50Mp, 1/1.28-inch layout), while the telephoto lens utilizes a large 1/1.4-inch 200Mp periscope setup. The ultra-wide camera is also getting an upgrade; a mid-sized 50Mp IMX8 sensor is currently undergoing testing, with a smaller 50Mp sensor serving as a backup option.

As vivo’s next-generation flagship, this upcoming model is widely expected to be named the vivo X500 Pro Max. This follows vivo’s naming convention of skipping the number “4” entirely, a pattern already seen in other device lines. For instance, the Y300 was directly succeeded by the Y500 series, and the X Fold3 was followed by the X Fold5.

Dimensity PM Engineering Device Spotted with Sony LOFIC Sensor, Rumored as vivo X500 Pro Max details

The vivo X500 Pro Max has already made an appearance in the GSMA database. The “Pro Max” designation strongly suggests that vivo will push the envelope even further in terms of imaging performance and processing power. According to the database entry, the device is slated for a global release, though final market deployment remains subject to change given the fast-paced nature of the mobile industry.

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