RedMagic has officially started teasing the RedMagic 11S Pro series and is putting a big spotlight on thermal design ahead of the phones’ May 18 launch. The company says the lineup will be the only gaming phone series in its class to combine liquid and active air cooling in one integrated system.
According to the announcement, the new cooling stack includes a pulse-style liquid-cooling engine built around fluorinated liquid similar to what is used in AI servers, a newly curved liquid channel layout, a proprietary ceramic micro-pump, and an anti-leak structure designed to improve drop resistance. On the active side, RedMagic is also promoting a 24,000 rpm internal fan with 0.1 mm ultra-thin blades, a through-channel airflow design, and IPX8-rated water resistance for the fan module.
The overall thermal architecture doesn’t stop there. RedMagic says the phones also use a 4D stepped VC system and a third-generation liquid metal solution that is intended to stay more stable and safer during use. Taken together, the company is clearly framing mobile cooling as one of the defining selling points of this generation rather than just an extra spec for enthusiasts.
The teaser also confirms that the RedMagic 11S Pro family will use Qualcomm’s fifth-generation Snapdragon 8 leading edition mobile platform. In terms of design, the phones continue the transparent Deuterium Front styling seen on earlier models and will be offered in silver and black color options.
While RedMagic is holding back the rest of the full spec sheet for the launch event, the early message is pretty clear: this series is being positioned for users who care about sustained gaming performance, aggressive thermal headroom, and the kind of hardware flourishes that help the phone stand out in the dedicated gaming segment. More detailed upgrades are expected when the company unveils the lineup on May 18.
